Package Level Fault Isolation

Thursday, November 16, 2023: 8:00 AM-9:20 AM
104 A-B (Phoenix Convention Center)
Mr. Joseph Caroselli, Advanced Micro Devices, Inc.
8:00 AM
Detecting Wafer Level Cu Pillar Defects Using Advanced 3D X-ray Microscopy (XRM) with Submicron Resolution
Ms. Susan Li, Infineon Technologies; Mr. John Frame, Infineon Technologies; Ms. Edita Madriaga-Berry, Infineon Technologies; Mr. Jose Hulog, Infineon Technologies; Dr. Ming Zhang, Infineon Technologies; Masako Terada, Carl Zeiss Microscopy; Mr. Allen Gu, Carl Zeiss Microscopy; Mr. David Taraci, Carl Zeiss Microscopy
8:20 AM
Nondestructive Package Level Fault Isolation of Multichip Power Module
Ms. Pui Leng Low, onsemi
8:40 AM
An Artificial Intelligence Powered Resolution Recovery Technique and Workflow to Accelerate Package Level Failure Analysis with 3D X-ray Microscopy
Ms. Syahirah Mohammad Zulkifli, Advanced Micro Devices Pte Ltd; Ms. Bernice Zee, Advanced Micro Devices (AMD); Ms. Qiu Wen, Advanced Micro Devices (AMD); Mr. Allen Gu, Carl Zeiss Microscopy; Dr. Andriy Andreyev, Carl Zeiss Microscopy; Masako Terada, Carl Zeiss Microscopy; Ms. Yanjing Yang, ZEISS Research Microscopy Solutions; Mr. Maverique Ong, Advanced Micro Devices (AMD)
9:00 AM
Near-Field Synthetic Aperture Focusing Technique to enhance the inspection capability of multi-layer HBM stacks in Scanning Acoustic Microscopy
Mr. Mario Wolf, PVA TePla Analytical Systems GmbH; Mr. Peter Hoffrogge, PVA TePla Analytical Systems GmbH; Mr. Bugra Birki, PVA TePla Analytical Systems GmbH; Chaitanya Bakre, Intel Corporation; Dr. Mario Pacheco, Intel Corporation; Dr. Peter Czurratis, PVA TePla Analytical Systems GmbH; Dr. Deepak Goyal, Intel Corporation
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