Backside IC Preparation Down to STI Level Using Chemical Mechanical Polishing (CMP) with Highly Selective Slurry

Wednesday, November 15, 2023
Exhibit Hall | West 1 (Phoenix Convention Center)
Dr. Norbert Herfurth , IHP – Leibniz-Institut für innovative Mikroelektronik, Frankfurt (Oder), Brandenburg, Germany
Dr. Gerfried Zwicker , zwickerconsult, Berlin, Berlin, Germany
Awwal A. Adesunkanmi , IHP – Leibniz-Institut für innovative Mikroelektronik, Frankfurt (Oder), Brandenburg, Germany, IHP – Leibniz-Institut für innovative Mikroelektronik, Frankfurt (Oder), Brandenburg, Germany
Prof. Christian Boit , Technische Universitaet Berlin, Berlin, Berlin, Germany

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