Masako Terada

Sr. Applications Engineer
Carl Zeiss Microscopy
Advanced Development
Dublin, CA
USA 94568

Papers:

Detecting Wafer Level Cu Pillar Defects Using Advanced 3D X-ray Microscopy (XRM) with Submicron Resolution
An Artificial Intelligence Powered Resolution Recovery Technique and Workflow to Accelerate Package Level Failure Analysis with 3D X-ray Microscopy