Die Level Fault Isolation

Wednesday, November 15, 2023: 10:20 AM-12:00 PM
104 A-B (Phoenix Convention Center)
Mr. Dan Bodoh, NXP Semiconductors and Ms. Lesly Endrinal, Google LLC
10:20 AM
Incorporating Time-Domain Reflectometry in Chip-Level Failure Analysis Workflow: Case Studies
Dr. Joy Liao, NVIDIA Corporation; Mr. Khanh Giang, NVIDIA Corporation; Mr. Timothy Pham, NVIDIA Corporation; Mr. Howard Marks, NVIDIA Corporation
10:40 AM
Photon Emission Intensity Analysis for Leakage Source Identification
Dr. Zhigang Song, IBM; Dr. Franco Stellari, IBM T.J. Watson Research Center; Mr. Phong Tran, IBM
11:00 AM
Methods to enhance infrared imaging for defect localization using lock-in thermography
Ms. Anjanashree M.R. Sharma, IMEC, KU Leuven; Dr. Kristof J.P. Jacobs, IMEC; Prof. Ingrid De Wolf, KU Leuven, IMEC
11:20 AM
Logical to Physical SRAM Bitmap Verification with Fault Localization
Mr. Alexander C. Maggiacomo, GLOBALFOUNDRIES; Dr. Rabindra Pahari, GLOBALFOUNDRIES; Mr. Torsten Schaefer, GLOBALFOUNDRIES; Mr. Gregory Billus, GLOBALFOUNDRIES; Mr. Suresh Shekar, GLOBALFOUNDRIES; Mr. Satish Kodali, GLOBALFOUNDRIES; Dr. Felix Beaudoin, GLOBALFOUNDRIES; Mr. Aaron Sinnott, GLOBALFOUNDRIES
11:40 AM
Electrical Event Capture with an Electron Beam Probing System
Mr. Neel Leslie, Thermo Fisher Scientific; Dr. James S. Vickers, Thermo Fisher Scientific; Mrs. Jennifer Huening, Intel; Dr. Tom X. Tong, Intel; Mr. Patrick Pardy, Intel Corp.
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