Packaging and Assembly

Tuesday, November 14, 2023: 2:10 PM-2:50 PM
103 A-B (Phoenix Convention Center)
Mrs. Sarah Wozny, Applied Materials and Mr. Robert Constantin, Intel
2:10 PM
FINITE ELEMENT ANALYSIS (FEA) AND FRACTOGRAPHY: COMPLEMENTARY METHODS IN UNDERSTANDING THE FACTORS RESULTING TO HAIRLINE DIE CRACK ON CHIP-ON-LEAD (COL) DEVICES
Mr. Renald Lindayao Dechino, Analog Devices, Inc.; Ms. Melanie S. Cajita, Analog Devices, Inc.; Mr. Nico Deus Villafranca, Analog Devices Inc.; Mr. Marionne Jose F. Javien, Analog Devices Inc.
2:30 PM
Discoloration: A Case of Mistaken Identity Callout For Reliability Stressed Palladium Coated Copper (PCC) Wires After Mold Compound Removal
Mr. Brian P. Yabut, onsemi; Ms. Rona Victoria C. Balabbo, onsemi; Mr. Mac Hariss H. Masiris, onsemi
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