Package and Physical Analysis Challenges Tutorial I

Sunday, November 12, 2023: 8:00 AM-10:00 AM

103 A-B (Phoenix Convention Center)

Mrs. Sarah Wozny, Applied Materials

8:00 AM

Non-destructive Defect Localization by Scanning Acoustic Microscopy and X-ray Imaging
Dr. Sebastian Brand, Fraunhofer Institute for Microstructure of Materials and Systems IMWS; Ms. Cheryl Hartfield, Carl Zeiss Microscopy, LLC; Dr. Thomas M. Moore, Waviks, Inc.

9:00 AM

What Packages Are in Your Mobile Device?
Mr. Trevor Yancey, TechSearch International, Inc.

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