Nanoprobing and Electrical Characterization I

Thursday, November 16, 2023: 1:30 PM-2:10 PM
103 A-B (Phoenix Convention Center)
Mr. David Albert, IBM (Retired) and Mr. John Sanders, Thermofisher
1:30 PM
Multilayer pFIB Trenches for Multiple Tip EBAC/EBIRCH Analysis and Internal Node Transistor Characterization
Mr. Nicholas Pronin, NXP Semiconductors; Dr. Stefano Larentis, NXP Semiconductors; Mr. Carey Wu, NXP Semiconductors; Mr. Eric Foote, NXP Semiconductors; Dr. Gary Clark, NXP Semiconductors; Mrs. Khiem Ly, NXP Semiconductors; Mr. Jacob Levenson, NXP Semiconductors; Mr. Kristofor Dickson, NXP Semiconductors; Mr. Charles Petri, NXP Semiconductors; Mr. Nelson Gomez, NXP Semiconductors; Mr. Tony Chrastecky, NXP Semiconductors
1:50 PM
Advances in EFA with color coded multi-channel nanoprobing
Dr. Grigore Moldovan, point electronic GmbH; Mr. William Courbat, Imina Technologies SA; Mr. Joerg Jatzkowski, Fraunhofer Institute for Microstructure of Materials and Systems IMWS
See more of: Technical Program