Mr. Paul Fischione

CEO
E.A. Fischione Instruments, Inc.
Export, PA
USA 15632

Papers:

TEM sample preparation for electron microscopy characterization and failure analysis of advanced semiconductor devices
Enhanced TEM specimen preparation for STEM-EBIC analysis using a Ga FIB system followed by post-FIB Ar ion beam milling
Failure investigation of copper-to-copper bonding in advanced 3D packaging: From sample preparation to structural characterization