Mr. Andreas Rummel

Kleindiek Nanotechnik
Reutlingen Germany 72770

Papers:

Combining Electrical Fault Isolation and Characterization Inside an SEM to Locate and Characterize Gate Leakages on a 3 nm Device
Top-down junction analysis in SiC MOSFET
Consideration of a Ga-FIB in Lamella Sample Prep for EBIC/EBAC Analysis of Advanced-node SRAMs
Advanced Nanoprobing and in situ sample exchange!