Mr. Greg Johnson

Zeiss Microscopy
Poughkeepsie, NY
USA 12603

Papers:

Defect localization methods for device characterization and yield management
Top-down junction analysis in SiC MOSFET
Consideration of a Ga-FIB in Lamella Sample Prep for EBIC/EBAC Analysis of Advanced-node SRAMs
AFM-in-SEM for precise endpoint delayering