System in Package (SiP) User Group Discussion
Zhiyong Wang, Analog Devices
Chandu Tanukonda, Intel Corporation
Jer O’Sullivan, Analog Devices
System in Package (SiP) is an advanced packaging process that answers the traditional Chip driven semiconductor industry attempts to fully incorporate product functionality into a single Chip. SiP is an effective cost-down strategy to large monolithic full function chips by integrating chips from multiple process nodes and technologies, with system performance enhancing components, into a single packaged product, maximising function density with lower costs per function, required to achieve early market delivery at competitive costs. Successful SiP packaging delivers fast to market, optimal Power, Thermal, Geometric and Cost product solutions.
System in Package (SiP) represents a cutting-edge packaging technology that addresses the limitations of traditional chip-centric approaches in the semiconductor industry. By integrating multiple chips from various process nodes and technologies into a single package, SiP maximizes functional density while reducing costs per function. This innovative approach not only enhances system performance but also accelerates time-to-market, providing a competitive edge.
SiP serves as an effective cost-reduction strategy compared to large monolithic full-function chips. It incorporates system performance-enhancing components, enabling the creation of highly functional products at a lower cost. The result is a comprehensive solution that meets the demands of early market delivery without compromising on quality or performance.
Successful SiP packaging delivers optimal solutions in terms of power efficiency, thermal management, geometric compactness, and cost-effectiveness. By leveraging SiP technology, we can achieve rapid market entry with products that offer superior performance and competitive pricing.
Please join the SiP user group in discussing the difficulties, challenges & opportunities these advanced SiP technologies bring to our FA labs.
Topics for System in Package User Group, ISTFA 2024 include the following:
- SiP – Failure Analysis Capabilities readiness
- Design for Failure Analysis
- Fault isolation challenges
- PFA – Physical Failure Analysis, challenges- new techniques & tools
- FA Vendors – providing solutions to complex SiP challenges