Nanoprobing, Electrical Characterization I

Friday, November 1, 2024: 8:00 AM-10:00 AM
202 (Hilton San Diego Bayfront)
Mr. Dave Albert, IBM (Retired) and Mr. JOHN sanders, Thermofisher
8:00 AM
SRAM Single Bit Cell Soft Failure and Nano-probing Methods
Dr. Zhigang Song, IBM; Mr. Michael Tenney, IBM; Mr. Larry Fischer, IBM; Mr. Dave Albert, IBM (Retired)
8:20 AM
Temperature Sensitive Failure Characterization Using Thermal Nanoprobing
Mr. Zvika Sapir, Intel; Dr. Avraham Raz, Intel; Mr. Andin Orana, Thermo Fisher Scientific
8:40 AM
Combining Electrical Fault Isolation and Characterization Inside an SEM to Locate and Characterize Gate Leakages on a 3 nm Device
Mr. Andreas Rummel, Kleindiek Nanotechnik GmbH; Dr. Matthias Kemmler, Kleindiek Nanotechnik GmbH; Mr. Klaus Schock, Kleindiek Nanotechnik GmbH; Dr. Andrew Jonathan Smith, Kleindiek Nanotechnik GmbH; Dr. Stephan Kleindiek, Kleindiek Nanotechnik GmbH; Dr. Lorenz Lechner, Kleindiek Inc.
9:00 AM
Revolutionizing Failure Analysis: EBAC Nanoprobing Analysis Insights into Inaccessible Floating Gates of Advanced Tech Node Automotive NVMs
Mr. P. K. Tan, Globalfoundries Singapore Ltd.; Dr. S. L. Ting, Globalfoundries Singapore Pte Ltd.; Ms. H. H. W. Thoungh, Globalfoundries Singapore Pte Ltd.; Mr. P.T. Ng, Globalfoundries Singapore Pte Ltd.; Dr. Alfred quah, GLOBALFOUNDRIES Singapore Pte Ltd; Dr. N.Y. Xu, Globalfoundries Singapore Ltd.; Ms. T.T. Yu, Globalfoundries Singapore Pte Ltd.; Ms. Jessica S.J. Oh, Globalfoundries Singapore Ltd.; Ms. Angela Teo, Globalfoundries Singapore; Mr. Yong Seng Tam, Globalfoundries Singapore Ltd.; Mr. K.K. Kang, Globalfoundries Singapore Ltd.; Dr. Chang Qing Chen, GLOBALFOUNDRIES Singapore Pte Ltd
9:20 AM
Pluck-and-Probe method for EBIRCH isolation of wordline defects in 3D replacement gate NAND
Mr. Chandler Rich, Micron Technology, Inc.; Dr. Wayne Harlow, Micron Technology, Inc.; Becky Munoz, Micron Technology, Inc.; Regino Sandoval, Micron Technology, Inc.; William Crow, Micron Technology, Inc.; Erik Jensen, Micron Technology, Inc.; J. Temo Davis, Micron Technology, Inc.; Dr. H. M. Ashfiqul Hamid, Micron Technology, Inc.
9:40 AM
Consideration of a Ga-FIB in Lamella Sample Prep for EBIC/EBAC Analysis of Advanced-node SRAMs
Mr. Andreas Rummel, Kleindiek Nanotechnik GmbH; Dr. Heiko Stegmann, Carl Zeiss Microscopy GmbH; Ms. Cheryl Hartfield, MA, FASM, ZEISS Microscopy; Dr. Lorenz Lechner, Kleindiek Inc.; Mr. Greg Johnson, Zeiss Microscopy
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