An optimized nano source for advancing X-ray inspection in the AI era
An optimized nano source for advancing X-ray inspection in the AI era
Monday, November 17, 2025: 3:40 PM
3 (Pasadena Convention Center)
Summary:
Advanced packaging is crucial for meeting the performance challenges brought by AI and widespread automation, but it also presents challenges. Increasingly complex architectures and processes must be checked for quality and stability, requiring techniques that can probe 3D structures at the nanoscale. X-ray inspection offers high-resolution imaging capabilities that can rapidly identify defects, enabling process improvement. The challenge is in achieving high resolution, imaging stability, and speed in X-ray inspection systems. Here we tackle these challenges with a new X-ray source optimized for high-resolution applications. We will address the basics concepts of X-ray imaging, before detailing our resolution, dose, stability, and long-term reliability measurements. The importance of several trade-offs relevant for semiconductor and electronics applications are highlighted.
Advanced packaging is crucial for meeting the performance challenges brought by AI and widespread automation, but it also presents challenges. Increasingly complex architectures and processes must be checked for quality and stability, requiring techniques that can probe 3D structures at the nanoscale. X-ray inspection offers high-resolution imaging capabilities that can rapidly identify defects, enabling process improvement. The challenge is in achieving high resolution, imaging stability, and speed in X-ray inspection systems. Here we tackle these challenges with a new X-ray source optimized for high-resolution applications. We will address the basics concepts of X-ray imaging, before detailing our resolution, dose, stability, and long-term reliability measurements. The importance of several trade-offs relevant for semiconductor and electronics applications are highlighted.