An Introduction to the FIB (Focused Ion Beam) as a Microchip Circuit Edit Tool
An Introduction to the FIB (Focused Ion Beam) as a Microchip Circuit Edit Tool
Sunday, November 16, 2025: 11:20 AM
1 (Pasadena Convention Center)
Summary:
Despite significant advances in modeling and extensive use of automated layout and checking algorithms, interconnect wiring mistakes and logic errors continue to happen in real-world integrated circuits. Focused Ion Beam (FIB) microchip circuit editing offers a solution to this problem. FIB edit is a well-established highly specialized laboratory technique for making changes to the operation of integrated circuits by selectively reconfiguring a chip’s internal functions. Beam induced etch and deposition nanomachining processes operated in a ‘direct write’ mode are used to selectively uncover buried circuitry and rewrite the copper wiring pattern. Transistors can be removed or modified to change their operating characteristics, and simple elements like resistors or capacitors added. This work can be performed at the wafer segment level and tested on a probe station, or executed on finished modules for full functional socket testing or system use. For many basic revisions the FIB edited rework units function essentially the same as the updated product will, except the results can be obtained weeks or even months earlier.
Despite significant advances in modeling and extensive use of automated layout and checking algorithms, interconnect wiring mistakes and logic errors continue to happen in real-world integrated circuits. Focused Ion Beam (FIB) microchip circuit editing offers a solution to this problem. FIB edit is a well-established highly specialized laboratory technique for making changes to the operation of integrated circuits by selectively reconfiguring a chip’s internal functions. Beam induced etch and deposition nanomachining processes operated in a ‘direct write’ mode are used to selectively uncover buried circuitry and rewrite the copper wiring pattern. Transistors can be removed or modified to change their operating characteristics, and simple elements like resistors or capacitors added. This work can be performed at the wafer segment level and tested on a probe station, or executed on finished modules for full functional socket testing or system use. For many basic revisions the FIB edited rework units function essentially the same as the updated product will, except the results can be obtained weeks or even months earlier.