Challenges in High-Precision Auto-TEM Process Development
Challenges in High-Precision Auto-TEM Process Development
Monday, November 17, 2025: 2:20 PM
1 (Pasadena Convention Center)
Summary:
Recent advancement in TEM automation receives a great attention due to strong demand of TEM for the failure analysis of semiconductor devices. However, there exist many challenges in achieving high-precision TEM lamella via automated TEM (auto-TEM) process, due to the complexity and limitations in FIB-SEM equipment used for TEM lamella preparation. In this report, the metrics for the performance of an auto-TEM process are defined with the key performance specifications (KPS), and the FIB-SEM equipment parameters that affect the KPS are discussed together with the experimental data which were collected from multiple FIB-SEM tools.
Recent advancement in TEM automation receives a great attention due to strong demand of TEM for the failure analysis of semiconductor devices. However, there exist many challenges in achieving high-precision TEM lamella via automated TEM (auto-TEM) process, due to the complexity and limitations in FIB-SEM equipment used for TEM lamella preparation. In this report, the metrics for the performance of an auto-TEM process are defined with the key performance specifications (KPS), and the FIB-SEM equipment parameters that affect the KPS are discussed together with the experimental data which were collected from multiple FIB-SEM tools.