Comparison of Manual and Semi-Automated FIB Sample Preparation Techniques for TEM Characterization of Semiconductor Devices
Comparison of Manual and Semi-Automated FIB Sample Preparation Techniques for TEM Characterization of Semiconductor Devices
Monday, November 17, 2025: 3:40 PM
1 (Pasadena Convention Center)
Summary:
With advancing technology nodes, the requirements for high-quality, high-throughput TEM imaging and TEM-based materials analysis of semiconductor devices for failure analysis, reverse engineering, and quality control are ever-increasing. This paper compares a semi-automated workflow using a state-of-the-art Helios 6HD DualBeam Ga+ FIB and the AutoTEM v.6.2.3 software with a manual sample preparation process that includes mechanical polishing and ion milling. The objective of this work is to highlight the strengths and weaknesses of both techniques and provide guidance on choosing the best approach for specific use cases depending on the target feature and device. The sample preparation techniques are evaluated based on TEM sample quality, the ability to target a site-specific device feature, and other operational aspects in the context of the semiconductor industry. As a result of establishing the new FIB workflow, sample production at TechInsights shifted from primarily manual to a combination of FIB and manual processes, depending on the specific device and feature.
With advancing technology nodes, the requirements for high-quality, high-throughput TEM imaging and TEM-based materials analysis of semiconductor devices for failure analysis, reverse engineering, and quality control are ever-increasing. This paper compares a semi-automated workflow using a state-of-the-art Helios 6HD DualBeam Ga+ FIB and the AutoTEM v.6.2.3 software with a manual sample preparation process that includes mechanical polishing and ion milling. The objective of this work is to highlight the strengths and weaknesses of both techniques and provide guidance on choosing the best approach for specific use cases depending on the target feature and device. The sample preparation techniques are evaluated based on TEM sample quality, the ability to target a site-specific device feature, and other operational aspects in the context of the semiconductor industry. As a result of establishing the new FIB workflow, sample production at TechInsights shifted from primarily manual to a combination of FIB and manual processes, depending on the specific device and feature.