Die Level Fault Isolation - Application of NAND FLASH Failure Analysis using Visible ThermoDynamic ® Imaging
Die Level Fault Isolation - Application of NAND FLASH Failure Analysis using Visible ThermoDynamic ® Imaging
Thursday, November 20, 2025: 2:10 PM
2 (Pasadena Convention Center)
Summary:
In this paper, we compare the conventional OBIRCH analysis with the new analysis method Thermo Dynamic Imaging (TDI) to demonstrate the effectiveness of the new method.. We also introduce case studies and provide examples.
In this paper, we compare the conventional OBIRCH analysis with the new analysis method Thermo Dynamic Imaging (TDI) to demonstrate the effectiveness of the new method.. We also introduce case studies and provide examples.