System in Package and 3D Devices
Monday, November 17, 2025: 4:00 PM-5:00 PM
3 (Pasadena Convention Center)
Mr. Neel Leslie, Thermo Fisher Scientific and Kevin Distelhurst, Intel
4:20 PM
Quantitative 3D-Defect Localization using Lock-In Thermography based on Lateral Phase Characteristics
Dr. Sebastian Brand, Fraunhofer Institute for Microstructure of Materials and Systems IMWS;
Mr. Michael Koegel, Fraunhofer Institute for Microstructure of Materials and Systems IMWS;
Mr. Christian Grosse, Fraunhofer Institute for Microstructure;
Chandu Devarajulu, Intel;
Francisco Benito, Intel;
Dr. Mario Pacheco, Intel;
Dr. Deepak Goyal, Intel Corporation;
Mr. Frank Altmann, Fraunhofer Institute for Microstructure of Materials and Systems
