System in Package and 3D Devices

Thursday, November 20, 2025: 1:30 PM-2:10 PM
2 (Pasadena Convention Center)
Mr. Neel Leslie, Thermo Fisher Scientific and Kevin Distelhurst, Intel
1:30 PM
Towards in situ failure analysis of multi-layer ceramic capacitors using x-ray nano-laminography
Dr. Till Dreier, Excillum AB; Dr. Jenny Romell, Excillum AB; Dr. Julius Hållstedt, Excillum AB
1:50 PM
Quantitative 3D-Defect Localization using Lock-In Thermography based on Lateral Phase Characteristics
Dr. Sebastian Brand, Fraunhofer Institute for Microstructure of Materials and Systems IMWS; Mr. Michael Koegel, Fraunhofer Institute for Microstructure of Materials and Systems IMWS; Mr. Christian Grosse, Fraunhofer Institute for Microstructure; Chandu Devarajulu, Intel; Francisco Benito, Intel; Dr. Mario Pacheco, Intel; Dr. Deepak Goyal, Intel Corporation; Mr. Frank Altmann, Fraunhofer Institute for Microstructure of Materials and Systems
2:10 PM
Die Level Fault Isolation - Application of NAND FLASH Failure Analysis using Visible ThermoDynamic ® Imaging
Mr. Yunki Jung, SAMSUNG ELECTRONICS Co.Ltd; Mr. Akihito Uchikado, Hamamatsu Photonics K.K.
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