Nanoscale Origins of Interfacial Degradation in Cu/Electroless/Electrolytic Stacks : a Correlative TEM/APT Study

Monday, November 17, 2025: 2:00 PM
3 (Pasadena Convention Center)
Mr. kyubum choi , LG Innotek, seoul, seoul, Korea, Republic of (South)

Summary:

This study examines interface‐specific failure mechanisms in semi‐additive process (SAP)–fabricated copper interconnects, revealing two distinct degradation pathways.
See more of: Microscopy Analysis and Material Characterization I
See more of: Technical Program