Microscopy Analysis and Material Characterization I

Monday, November 17, 2025: 1:40 PM-2:40 PM

3 (Pasadena Convention Center)

Dr. Cecile S. Bonifacio, E.A. Fischione Instruments, Inc. and Prof. Rosine COQ GERMANICUS, Normandie Univ, Ensicaen, Unicaen, CNRS, CRISMAT UMR6508

1:40 PM

First and Preliminary Approach at the Usage of FIB ToF for Borophosphilicate Layer Characterization Directly on Device Failing Structures
Dr. Domenico Mello, EM Microelectronic, a Company of the Swatch Group; Dr. Clement Huguenot, EM Microelectronic, a Company of the Swatch Group; Dr. Guillaume Fiannaca, EM Microelectronic, a Company of the Swatch Group; Dr. Heiko Stegmann, Carl Zeiss Microscopy GmbH; Dr. Hubert Schulz, Carl Zeiss Microscopy GmbH

2:00 PM

2:20 PM

Applications of Electron Energy Loss Near-Edge Structure Analysis for Defect Characterization in Advanced Semiconductor Devices
Mr. Eric Yi, NXP Semiconductors; Mr. Jacob Levenson, NXP Semiconductors; Dr. Sam Subramanian, NXP Semiconductors; Mr. Rik Otte, NXP Semiconductor; Mrs. Khiem Ly, NXP Semiconductors

See more of: Technical Program