Effective Failure Analysis Approach in Locating Circuit Level Continuity Defects
Effective Failure Analysis Approach in Locating Circuit Level Continuity Defects
Tuesday, November 18, 2025: 11:10 AM
2 (Pasadena Convention Center)
Summary:
Uncovering high-resistance to open-circuit defects in integrated circuits demands a thorough and methodical failure analysis (FA) approach. These elusive defects often escape detection, showing only subtle signs like low current during electrical verification or high resistance in I-V curve tracing, making fault isolation difficult and time-consuming. This paper highlights three compelling case studies that showcase the practical application and effectiveness of the FA approach in exposing the root cause: missing or damaged Thin Film Resistors (TFRs). Through detailed analysis, these resistors were revealed as the key culprits behind continuity failures, demonstrating how a strategic FA process can uncover subtle circuit-level defects.
Uncovering high-resistance to open-circuit defects in integrated circuits demands a thorough and methodical failure analysis (FA) approach. These elusive defects often escape detection, showing only subtle signs like low current during electrical verification or high resistance in I-V curve tracing, making fault isolation difficult and time-consuming. This paper highlights three compelling case studies that showcase the practical application and effectiveness of the FA approach in exposing the root cause: missing or damaged Thin Film Resistors (TFRs). Through detailed analysis, these resistors were revealed as the key culprits behind continuity failures, demonstrating how a strategic FA process can uncover subtle circuit-level defects.