A Review of IO Debug Techniques in Chip-Level Failure Analysis: Case Studies and Workflow
A Review of IO Debug Techniques in Chip-Level Failure Analysis: Case Studies and Workflow
Tuesday, November 18, 2025: 10:30 AM
3 (Pasadena Convention Center)
Summary:
Shrinking technology nodes and the adoption of advanced packaging have significantly increased the complexity of I/O debugging. Restricted physical access, signal integrity degradation, and limited fault isolation resolution collectively contribute to elusive failure signatures. This paper presents a multi-technique, non-destructive Electrical Failure Analysis (EFA) strategy to address complex I/O failures through real-world case studies. Techniques such as Photoemission Microscopy (PEM), Lock-in Thermography (LIT), and Static Laser Stimulation with Lock-In mode (LI-SLS) are evaluated in conjunction with circuit analysis and schematic/layout signal tracing. The results demonstrate that no single technique is sufficient; rather, an adaptive approach—built upon deep circuit understanding and close collaboration between design and physical failure analysis (PFA) teams—is essential for accurate fault localization and effective root cause analysis.
Shrinking technology nodes and the adoption of advanced packaging have significantly increased the complexity of I/O debugging. Restricted physical access, signal integrity degradation, and limited fault isolation resolution collectively contribute to elusive failure signatures. This paper presents a multi-technique, non-destructive Electrical Failure Analysis (EFA) strategy to address complex I/O failures through real-world case studies. Techniques such as Photoemission Microscopy (PEM), Lock-in Thermography (LIT), and Static Laser Stimulation with Lock-In mode (LI-SLS) are evaluated in conjunction with circuit analysis and schematic/layout signal tracing. The results demonstrate that no single technique is sufficient; rather, an adaptive approach—built upon deep circuit understanding and close collaboration between design and physical failure analysis (PFA) teams—is essential for accurate fault localization and effective root cause analysis.