AI Applications for Failure Analysis I

Tuesday, November 18, 2025: 10:30 AM-11:50 AM
1 (Pasadena Convention Center)
Dr. Sebastian Brand, Fraunhofer Institute for Microstructure of Materials and Systems IMWS and Zachary Eich, AMD
10:30 AM
AI-based image enhancement improves detection of white bump defects
Raphael Wilhelmer, Materials Center Leoben Forschung GmbH; Dr. Roland Brunner, Materials Center Leoben Forschung GmbH; Dr. Tatjana Djuric-Rissner, PVA TePla Analytical Systems GmbH; Hsien-Wei Ho, Advanced Semiconductor Engineering (ASE) Inc; Chun-Hsien Lee, Advanced Semiconductor Engineering (ASE) Inc; Chun-Liang Kuo, Advanced Semiconductor Engineering (ASE) Inc
See more of: Technical Program
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