AI Applications for Failure Analysis I

Tuesday, November 18, 2025: 10:30 AM-11:50 AM
1 (Pasadena Convention Center)
Dr. Sebastian Brand, Fraunhofer Institute for Microstructure of Materials and Systems IMWS and Zachary Eich, AMD
10:30 AM
AI-based image enhancement improves detection of white bump defects
Raphael Wilhelmer, Materials Center Leoben Forschung GmbH; Dr. Roland Brunner, Materials Center Leoben Forschung GmbH; Dr. Tatjana Djuric-Rissner, PVA TePla Analytical Systems GmbH; Hsien-Wei Ho, Advanced Semiconductor Engineering (ASE) Inc; Chun-Hsien Lee, Advanced Semiconductor Engineering (ASE) Inc; Chun-Liang Kuo, Advanced Semiconductor Engineering (ASE) Inc
10:50 AM
Enhancing Analysis of Warped Substrates using Non-Destructive 3D X-ray Imaging, Advanced Image Manipulation, and AI Segmentation
Vineeth Bastin, Comet Technologies USA inc; Luke Hunter, Comet Technologies Canada Inc; Zixiong Cao, Comet Technologies Canada Inc; David Kruidhof, Comet Technologies USA inc; Jonathan Chuck, Comet Technologies USA inc
11:10 AM
Advanced Data Imputation Methodology for Handling Missing Values in the Semiconductor Manufacturing Process
Ms. Julee Kim, Samsung Electronics; Mr. Seokyeong Kim, Samsung Electronics; Mr. Soojae Heo, Samsung Electronics; Mr. Hyoungjun Kim, Samsung Electronics; Mr. Junghwan Lee, Samsung Electronics
11:30 AM
TEST
Mrs. Stefanie Bourbon, ASM International
See more of: Technical Program
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