52nd International Symposium for Testing and Failure Analysis (October 4-8, 2026): https://www.asminternational.org/istfa-2026/

52nd International Symposium for Testing and Failure Analysis (October 4-8, 2026)
October 4 - 8, 2026

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Xiaochen Zhu

Technologist
Sandisk Technologies Inc
Milpitas, CA
USA

Papers:

Understanding the Root Cause of Transient Failures in NAND-Type 3D Flash Memory
Localization of Gate Oxide Defects in Pool Capacitors in NAND-type 3D Flash memory
Failure analysis methods to localize defects in data path on 3D Flash memory products

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General Information

October 4 - 8, 2026


San Antonio, TX