Rik Otte

Physical failure analysis technical staff
NXP Semiconductor
Failure analysis
Nijmegen, Nijmegen
Netherlands

Papers:

Localizing Fringe Capacitor Shorts in Advanced Nodes Using a VC Guided FIB Rule Out Methodology and PFIB Delayering
Bridging a Gap between Physical and Electrical Failure Analysis: Fault Localization on TEM Lamellae Enabled by Workflow Redesign and optional Probing Pads
Recrystallization Mechanisms of Ball Grid Array SAC Solder Joint under Thermal Cycling observed with Electron Backscattered Diffraction