AI Applications for Failure Analysis I

Tuesday, October 6, 2026: 10:10 AM-11:00 AM
Dr. Sebastian Brand, Fraunhofer Institute for Microstructure of Materials and Systems IMWS and Zachary Eich, AMD
10:10 AM
Enhancement of Scanning Acoustic Microscopy in Robustness, Precision and Automation through AI-based signal analysis
Dr. Sebastian Brand, Fraunhofer Institute for Microstructure of Materials and Systems IMWS; Mr. Lorenz Heinemann, Fraunhofer IMWS; Mr. Frank Altmann, Fraunhofer Institute for Microstructure of Materials and Systems; Mr. Michael Koegel, Fraunhofer Institute for Microstructure of Materials and Systems IMWS
10:30 AM
Few-shot Segmentation of Advanced 3D IC Structures Under Varying X-ray Acquisition Strategies
Mr. Patrick Craig, University of Florida; Mr. Pratyush Shukla, University of Florida; Mr. Shajib Ghosh, University of Florida; Ms. Antika Roy, University of Florida; Jeff Gelb, Sigray Inc; Dr. Anasuya Adibhatla, Sigray Inc; Dr. Navid Asadi, University of Florida
10:50 AM
Revolutionizing Failure Analysis: Physics-Guided AI for Advanced Technology CAD Alignment
Mr. Nathan Linarto, AMD; Dr. Venkat Ravikumar, Advanced Micro Devices - Singapore Pte Ltd; Ms. Angeline phoa, Advanced Micro Devices - Singapore Pte Ltd; Prof. Na Zhao, SIngapore University of Technology and Design
11:10 AM
Standardizing Failure Analysis Data and Enabling AI-Driven Learning Through Structured FA Reporting and Legacy Document Conversion
Mr. Arshdeep Singh, Synopsys Inc.
11:30 AM
An Integrated AI Platform for Accelerating Semiconductor Failure Analysis: Combining Similarity Search, Deep-Learning Image Retrieval, Automated Labeling, and Ontology-Guided Workflow Assistance
Dr. Michael Beetz, INFINEON TECHNOLOGIES; Mr. Clemens Grünewald, INFINEON TECHNOLOGIES; Mr. Thomas Gänsler, Infineon Technologies Dresden GmbH & Co. KG; Mr. Christian Burmer, Infineon Tech. AG; Dr. Konstantin Schekotihin, Universität Klagenfurt
See more of: Technical Program
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