FA Process: Fault Isolation, Mechanisms & Solutions I
Wednesday, October 7, 2026: 8:00 AM-9:40 AM
206 A-B (Henry B. González Convention Center)
Vinod Narang, Advanced Micro Devices (S) Pte Ltd and Rosalinda Ring, NenoVision s. r. o.
8:40 AM
Failure Analysis of Elevated Contact-Chain Resistance and Corrective Action
Dr. Wentao Qin, Microchip Technologies Inc.;
Mr. Esteban Ortiz, Microchip Technologies Inc.;
Mr. Lonne Blecha, Microchip Technologies Inc.;
Mr. Rajesh Nayak, Microchip Technology;
Dr. Abhijeet Budruk, Microchip Technologies Inc.;
Mr. Rodney Shroeder, Microchip Technologies Inc.;
Rohan Braithwaite, Microchip Technologies Inc.;
Joshua Sanner, Microchip Technologies Inc.;
Mr. Eric Hankins II, Microchip Technologies Inc.;
Ms. Denise Barrientos, Microchip Technologies Inc.;
Mr. Hyrum Williams, Microchip Technologies Inc.;
Mr. Al Merino, Microchip Technologies Inc.;
Ms. Heather Hoke, Microchip Technologies Inc.
9:20 AM
Quantitative TIM Coverage Analysis Using CSAM and 3D XRM for Advanced Packages
Dr. Lu Fang, Marvell Technology;
Ms. Susan Li, Marvell Technology;
Mr. Johnson Sy, Marvell Technology;
Mr. Fung G. Lien, Marvell Technology;
Mr. Sumanth Thirunavukkarasu, Marvell Technology;
Mr. Jian Yuan Wong, Marvell Technology;
Masako Terada, Carl Zeiss Microscopy;
Dr. Allen Gu, Zeiss Microscopy; Carl Zeiss Microscopy;
Dr. Alaba Bamido, Marvell Technology;
Mr. Choong Kooi Chee, Marvell Technology;
Dr. Dwayne R. Shirley, Marvell Technology