FA Process: Fault Isolation, Mechanisms & Solutions I

Wednesday, October 7, 2026: 8:00 AM-9:40 AM
Vinod Narang, Advanced Micro Devices (S) Pte Ltd and Rosalinda Ring, NenoVision s. r. o.
8:00 AM
Enhanced Test Socket Reliability: Multi-Modal Failure Analysis and Design Optimization for High-Volume Semiconductor Manufacturing
Ms. Ella L. Schwirzke, B.S., Porland State University, Tektronix Component Solutions; Ms. Rachael M. Gitnes, Tektronix Component Solutions; Christopher Maciel, B.S. EE, Tektronix Component Solutions
8:20 AM
Failure Analysis Approach on Intricate Redistribution Layer (RDL) Failures
Ms. Claide Fenomeno, Analog Devices Inc; Mr. Joshua Michael Valencia, Analog Devices Inc
8:40 AM
Failure Analysis of Elevated Contact-Chain Resistance and Corrective Action
Dr. Wentao Qin, Microchip Technologies Inc.; Mr. Esteban Ortiz, Microchip Technologies Inc.; Mr. Lonne Blecha, Microchip Technologies Inc.; Mr. Rajesh Nayak, Microchip Technology; Dr. Abhijeet Budruk, Microchip Technologies Inc.; Mr. Rodney Shroeder, Microchip Technologies Inc.; Rohan Braithwaite, Microchip Technologies Inc.; Joshua Sanner, Microchip Technologies Inc.; Mr. Eric Hankins II, Microchip Technologies Inc.; Ms. Denise Barrientos, Microchip Technologies Inc.; Mr. Hyrum Williams, Microchip Technologies Inc.; Mr. Al Merino, Microchip Technologies Inc.; Ms. Heather Hoke, Microchip Technologies Inc.
9:00 AM
Localization of Capacitive Open Defects Using ThermoDynamic Imaging
Mr. Shota Nozue, Hamamatsu Photonics K.K.; Mr. Nakaba Matsui, Hamamatsu Photonics K. K; Mr. Akihito Uchikado, Hamamatsu Photonics K.K.; Mr. Shimpei Tominaga, Hamamatsu Photonics K.K.
9:20 AM
Quantitative TIM Coverage Analysis Using CSAM and 3D XRM for Advanced Packages
Dr. Lu Fang, Marvell Technology; Ms. Susan Li, Marvell; Mr. Johnson Sy, Marvell Technology
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