Package Analysis

Sunday, October 4, 2026: 8:00 AM-10:00 AM
Dr. Cecile S. Bonifacio, EA Fischione Instruments and Ms. Melissa Mullen, Thermo Fisher Scientific
8:00 AM
Chip Scale Packaging Overview and Failure Analysis Challenges
Ms. Susan Li, Marvell
8:20 AM
Flip Chip and Backside Techniques
Dr. Edward I. Cole Jr., FASM, Sandia National Laboratories; Kira L. Fishgrab, Sandia National Laboratories; Dr. Daniel L. Barton, Sandia National Laboratories; Dr. Karoline Bernhard-Hofer, Infineon
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