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| Session 13: Yield Enhancement | ||||
| Location: Meeting Room J1-J2 (San Jose McEnery Convention Center) | ||||
| (Please check final room assignments on-site). | ||||
| Session Description: | ||||
| Session Chair: | Ms Carol Boye IBM | |||
| 11:00 AM | Tool-Related ESD Surface Damage (ESDFOS) on Wafers in Cu Technology | |||
| 11:25 AM | Detection and Verification of Silicide Pipe Defects on SOI Technology using Voltage Contrast Inspection | |||
| 11:50 AM | Photo Process Margin Leading To IC Failures- A case Study | |||
| 12:15 PM | Failure Analysis of Multi Finger HV Symmetric Device for Charge Pumping Circuit Application | |||
| 12:40 PM | Cu Voiding in 90nm Technology Through Photovoltaic-Driven Electrochemical Dissolution | |||