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The 35th International Symposium for Testing and Failure Analysis (November 15-19, 2009) of ASM |
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| Session 5: Sample Preparation | ||||
| Location: Meeting Room J3 (San Jose McEnery Convention Center) | ||||
| (Please check final room assignments on-site). | ||||
| Session Description: Sample Preparation includes techniques and/or processes that prepare samples for analysis by gaining access to the front side of a circuit or access to the bulk silicon of a packaged die. Techniques and/or process include chemical or laser decapsulation, chemical and/or mechanical polishing, etc. | ||||
| Session Chairs: | Ms. Becky Holdford Texas Instruments, Dallas, TX Robert Champaign Raytheon | |||
| 8:00 AM | Localized Epoxy Layer Formation on Surface Defect Using a Micro-brush in a Plucking System | |||
| 8:25 AM | Deterministic Polishing Applications In Failure Analysis | |||
| 8:50 AM | Near-Infrared Microscopy In Semiconductor Failure Analysis Aplications | |||
| 9:15 AM | Non-Destructive Failure Analysis in Organic Thin-Film Transistors | |||
| 9:40 AM | Low Temperature O2 Plasma Process for Scanning Capacitance Sample Preparation | |||