35th International Symposium for Testing and Failure Analysis (November 15-19, 2009): Session 11: Advanced Metrology and System Level FA

Thursday, November 19, 2009: 10:15 AM-11:30 AM

Meeting Room J3 (San Jose McEnery Convention Center)

Session Chairs:

Mr. Apek Mulay , Mr. David Burgess , Dr. James J. Demarest and Dr. Sam Subramanian

10:15 AM

Start up and Evolution of a FEI DA 300 DBFIB for Automatic STEM Sample Preparation
Dr. James J. Demarest, IBM; Dr. Zubin DeSouza, FEI

10:40 AM

The Helium Ion Microscope for High Resolution Imaging, Materials Analysis, Circuit Edit and FA Applications
Dr. William B. Thompson, Carl Zeiss SMT; John Notte, Carl Zeiss SMT; Larry Scipioni, Carl Zeiss SMT; Mohan Ananth, Carl Zeiss SMT; Lewis Stern, Carl Zeiss SMT; Dave Ferranti, Carl Zeiss SMT; Chuong Huynh, Carl Zeiss SMT; Sybren Sijbrandij, Carl Zeiss SMT; Lou Farkas, Carl Zeiss SMT; Louise Barriss, Carl Zeiss SMT; Colin Sanford, Carl Zeiss SMT

11:05 AM

Damage Induced Field Failures of Electrical Contacts
Mr. Aravind Munukutla, Intel Corporation; Mr. Randy Rahn, Intel Corporation; Mr. JS Lewis, Intel Corporation

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