35th International Symposium for Testing and Failure Analysis (November 15-19, 2009): Microscopy

Monday, November 16, 2009: 8:15 AM-5:00 PM

Meeting Room J3 (San Jose McEnery Convention Center)

Session Chair:

Ms. Susan Li

8:15 AM

X-Ray & SAM Challenges for IC Package Inspection
Dr. Thomas M. Moore, Omniprobe, Inc.; Ms. Cheryl Hartfield, Omniprobe, Inc.; Mrs. Gay Samuelson, Translational Genomic Institute

9:00 AM

TEM Techniques for FA
Dr. Sam Subramanian, Freescale Semiconductor, Inc.

10:30 AM

Break

11:00 AM

The Role of the AFM in Yield and FA
Mr. Jim Colvin, FA Instruments

12:00 PM

Lunch

1:00 PM

Scanning Electron Microscopy
Dr. William Vanderlinde, IARPA

2:15 PM

Ultra-High Resolution Scanning Electron Microscopy
Dr. William Vanderlinde, IARPA

3:15 PM

Break

3:30 PM

Optical and Infrared FA Microscopy
Mr. John J. McDonald, Quantum Focus Instruments Corporation

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