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| Session 13: Defect Characterization & Metrology - II | ||||
| Location: Lalique Ballroom (InterContinental Hotel Dallas) | ||||
| (Please check final room assignments on-site). | ||||
| Session Description: | ||||
| Session Chairs: | Mr. Phil Kaszuba IBM Microelectronics, Essex Junction, VT Mr. Terrance Kane IBM, Hopewell Junction, NY | |||
| 3:10 PM | 12.1 | EDX Performance Across Multiple Transmission Electron Microscope Platforms | ||
| 3:35 PM | 12.2 | Highly Resistive AlN Formation in TiN / AlCu / TiN Stack Evidenced by EELS TEM and XPS | ||
| 4:00 PM | 12.3 | Scanning Capacitance Microscopy for Failure Analysis of SOI Devices | ||
| 4:25 PM | 12.4 | Wafer Level Atomic Force Probing | ||