Mr. Kim Hong Yip

Principal Engineer
GLOBALFOUNDRIES Singapore Pte Ltd
Product, Test and Failure Analysis
60 Woodlands Industrial Park D Street 2, Singapore 738406
Singapore Singapore 738406

Papers:
Failure Analysis Methodology on Systematic Missing Cu in RAM Due to Cu CMP Applications of AFP Nanoprobing for Localization of Implant Related Issues Effective and Efficient FEOL Defects Localization/ Inspection By Selective Mechanical/Chemical Deprocessing