18
Packaging and Assembly Level FA II

Thursday, November 5, 2015: 10:25 AM-11:40 AM
Meeting Room D137 & 138 (Oregon Convention Center )
Session Chairs:  Mr. Bhanu P. Sood, Mechanical Engineering, CALCE, University of Maryland, College Park, MD and Dr. Lihong Cao, Quality & Reliability Engineering, Advanced Micro Devices, Austin, TX
10:25 AM
18.1
Acid Decapsulation for silver bonded wire package
Mr. Satoshi Suzuki, Nippon Scientific Co., LTD.
10:50 AM
18.2
What happens to ESDS (Electrostatic Sensitive Devices) in case of direct ESD from plastics?
Prof. Peter Jacob, EMPA Duebendorf (50%, 1993-today, Main Affiliation)
11:15 AM
18.3
Root cause analysis of a connector pin time-delayed fracture
Dr. Prabjit Singh, PhD, IBM; Dr. Robert Davis, PhD, IBM
See more of: Technical Program
<< Previous Session | Next Session >>