Mr. Ang Ghim Boon

Deputy Director
GLOBALFOUNDRIES Singapore Pte Ltd
Product, Test and Failure Analysis
Singapore Singapore 738406

Papers:

Optimization of EeLADA for Circuit Logic Defect Localization Using Defect Simulation
Failure Analysis Methodology on Systematic Polar failing pattern due to higher Solder Bump Resistance issue in RF SOI device
Electrical and nanoprobing analysis on the implantion-related invisible defect
MEMS Failure Analysis In Wafer Fabrication