Microscopy - Poster

Wednesday, November 8, 2017: 1:30 PM-3:30 PM
Dr. Yu Zhu, IBM TJ Watson Research Center and Dr. Tom Schamp, Hitachi High Technologies, America
Quantitative FIB-SEM 3D Tomography for Failure Analysis
Dr. zhipeng li, Western Digital; Dr. jianxin fang, Western Digital; Dr. Haifeng Wang, PhD, Western Digital Corporation
Maximizing the Electron Microscopy Contrasts for Analysis
Dr. Suey Li Toh, Data Storage Institute; Dr. Rong Ji, Data Storage Institute
Failure analysis and defect inspection of high electron mobility transistors by high resolution cathodoluminescence
Dr. Christian Monachon, PhD, Attolight; Dr. Marcin S. Zielinksi, PhD, Attolight; Dr. David Gachet, PhD, Attolight; Dr. Samuel Sonderegger, PhD, Attolight; Mr. Sylvain Muckenhirn, Attolight; Dr. Jean Berney, Attolight; D. Poppitz, Fraunhofer Institute for Microstructure of Materials and Systems IMWS; A. Graff, Fraunhofer Institute for Microstructure of Materials and Systems IMWS; S. Breuer, Fraunhofer Institute for Applied Solid State Physics IAF; L. Kirste, Fraunhofer Institute for Applied Solid State Physics IAF
Electrical characterisation and failure analysis using in operando TEM
Dr. Yevheniy Pivak, DENSsolutions; Mr. Mike Coy, Gatan
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