Emerging FA Techniques and Concepts

Monday, October 29, 2018: 10:20 AM-12:20 PM
120A (Phoenix Convention Center)
Mr. Frank Altmann, Fraunhofer Institute for Microstructure of Materials and Systems IMWS and Mr. Dan Bodoh, NXP Semiconductors
10:20 AM
Automated Contactless Defect Analysis Technique using Computer Vision
Dr. Franco Stellari, IBM Research; Dr. Chung-Ching Lin, IBM T.J. Watson Research Center; Mr. Thomas Wassick, IBM Systems; Tom Shaw, IBM Research; Dr. Peilin Song, IBM T.J. Watson Research Center
10:45 AM
Pattern search automation for combinational logic analysis
Mr. Venkat Ravikumar, SIngapore University of Technology and Design; Ms. YX Seah, Advanced Micro Devices - Singapore Pte Ltd1; Mr. G lim, Mr, Advanced Micro Devices - Singapore Pte Ltd1; Mr. W lua, Advanced Micro Devices - Singapore Pte Ltd; Mr. Gopinath ranganathan, Advanced Micro Devices - Singapore Pte Ltd; C.M. Chua, SEMICAPS PTE LTD, Singapore; S.L. Phoa, Advanced Micro Devices - Singapore Pte Ltd
11:10 AM
Scan Chain Fault Isolation using Single Event Upsets Induced by a Picosecond 1064nm Laser
Dr. Keith A. Serrels, NXP Semiconductors; Mr. Kristofor Dickson, NXP Semiconductors; Mr. Dan Bodoh, NXP Semiconductors; Mr. Kent Erington, NXP Semiconductors; Mrs. Anusha Weerakoon, NXP Semiconductors; Mr. Eric Foote, NXP Semiconductors
11:35 AM
Non-Destructive Visualization of bond pad cratering defects using acoustic microscopy in the GHz-band
Dr. Sebastian Brand, Fraunhofer Institute for Microstructure of Materials and Systems IMWS; Dr. Stefan Oberhoff, Robert Bosch GmbH; Mr. Michael Kögel, Fraunhofer Institute for Microstructure of Materials and Systems IMWS; Michael Wiedenmann, Robert Bosch GmbH; Mr. Joerg Krinke, Robert Bosch GmbH; Mr. Frank Altmann, Fraunhofer Institute for Microstructure of Materials and Systems IMWS
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