Microscopy II

Thursday, November 1, 2018: 9:50 AM-11:30 AM
225AB (Phoenix Convention Center)
Dr. Edgar Voelkl, PhD in Physics, Hitachi High Technologies America, Mr. Yifei Meng, EAG and Dr. Lianfeng Fu, Lam Research Corporation
9:50 AM
Identification of Defective Fin by E-beam Induced Current in Advanced FinFET Device Failure Analysis
Dr. Yuting wei, GLOBALFOUNDRIES Inc.; Dr. Chuan Zhang, GLOBALFOUNDRIES Inc.; Mr. Liangshan Chen, GLOBALFOUNDRIES Inc.; Mr. Chong Khiam Oh, GLOBALFOUNDRIES Inc.
10:15 AM
High-resolution resistance mapping in SEM
Dr. Grigore Moldovan, point electronic GmbH; Mr. Jörg Jatzkowski, Fraunhofer Institute for Microstructure of Materials and Systems IMWS; Mr. Guillaume Boetsch, Imina Technologies SA; Mr. Wolfgang Joachimi, point electronic GmbH; Mr. Frank Altmann, Fraunhofer Institute for Microstructure of Materials and Systems
10:40 AM
Correlation of stress release during sample preparation for TEM CBED measurements
Mr. Jürgen Gluch, Fraunhofer IKTS; Mr. Uwe Mühle, TU Dresden; Mr. Martin Gall, Fraunhofer IKTS; Prof. Ehrenfried Zschech, Fraunhofer IKTS; Mr. Chandran Narendraraj, TESCAN Brno; Mr. Miloš Hrabovský, TESCAN Brno; Mr. Tomáš Morávek, TESCAN Brno
11:05 AM
Electron Channeling Contrast Imaging (ECCI) for beyond Silicon materials characterization
Mr. Libor Strakos, Thermo Fisher Scientific; Dr. Andreas Schulze, Imec; Mr. Ondrej Machek, Thermo Fisher Scientific; Dr. Tomas Vystavel, Thermo Fisher Scientific; Mr. Matty Caymax, Imec; Dr. Richard J. Young, Thermo Fisher Scientific
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