FA Processes Case Studies - POSTER

Wednesday, October 31, 2018: 2:20 PM-4:20 PM
Dr. Chuan Zhang, GLOBALFOUNDRIES Inc. and Dr. Erwin Hendarto, Silicon Labs
Failure modes, mechanisms and analysis methods for a microcontroller-based System on Chip (SoC)
Mr. Junald C. Saludares, Microchip; Ms. Airene De Guzman, Microchip; Mr. John Stephen Bernil, Microchip
Investigating Root Cause of a Bubble Formation in Spin on Hardmask
Dr. Rebecca D. Dar, GLOBALFOUNDRIES; Jason Behnke, GLOBALFOUNDRIES; Frieder Baumann, GLOBALFOUNDRIES; Timothy Shepherd, GLOBALFOUNDRIES; Kok Hin (Rick) Teo, GLOBALFOUNDRIES; Wayne Zhao, GLOBALFOUNDRIES; Joshua Moore, GLOBALFOUNDRIES; Laurent Dumas, GLOBALFOUNDRIES
Case Study on Abnormal Electron-Optical Frequency Mapping phenomena in Failure Analysis
Mr. Ang Li, NXP Semiconductors-(China) Limited; Mr. Ryan Xiao, NXP Semiconductors-(China) Limited; Mr. Max Guo, NXP Semiconductors-(China) Limited; Mr. Jinglong Li, NXP Semiconductors-(China) Limited; Mr. Binghai Liu, NXP Semiconductors-(China) Limited; Mr. KE-YING LIN, NXP Semiconductors
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