Sample Preparation and Device Deprocessing II

Wednesday, October 31, 2018: 1:05 PM-2:20 PM

226BC (Phoenix Convention Center)

Mr. Huei Hao Yap, Globalfoundries Inc. Malta, NY USA and Mr. Ryan Fredrickson, On Semiconductor

1:05 PM

Preserving Evidence for Root Cause Investigations with Halogen-Free Microwave Induced Plasma Decapsulation
Dr. Charles A. Odegard, SMTS, Texas Instruments, Inc.; Mr. Andy Burnett, SMTS, Texas Instruments, Inc.; Dr. Jiaqi Tang, JIACO Instruments; Ms. Jing Wang, JIACO Instruments B.V.

1:30 PM

Uniform Mechanical Deprocessing Stacked Memory Modules
Mr. Gary Liechty, Allied High Tech Products, Inc.; Mr. Chris Richardson, Allied High Tech Products, Inc.

1:55 PM

Advances in large-area microelectronic device deprocessing for physical failure analyses and quality control
Dr. Pawel Nowakowski, E.A. Fischione Instruments, Inc.; Mr. Michael F. Boccabella, E.A. Fischione Instruments, Inc.; Ms. Mary Ray, E.A. Fischione Instruments, Inc.; Mr. Paul Fischione, E.A. Fischione Instruments, Inc.

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