Case Studies: Device Analysis

Wednesday, November 3, 2021: 8:00 AM-9:40 AM
104 ABC (Phoenix Convention Center)
* Wireless, Self-Powered, Sensors,
* MEMS Failure Analysis
* Power, Discretes and Optoelectronic Device FA
* Organic Electronic (OLED...)
* Novel memory FA
* Alternative Energy (Photovoltaics, Solid State Lighting, etc.)
* Space Application FA
Mr. Stephen Fasolino, Raytheon and Mr. Jeff Gambino, ON Semiconductor
8:00 AM
Failure Analysis Challenges of Phase Change Memory Test Structures with Two Case Studies
Dr. James J. Demarest, IBM; Dr. Norbert Arnold, IBM Research; Dr. Kevin Brew, IBM; Dr. Victor Chan, IBM; Adam Cote, IBM; Tarl Gordon, IBM; Mr. Michael Iwatake, IBM; Guoda Lian, IBM Inc.; Dr. Juntao Li, IBM Research; Dr. Injo Ok, IBM; Steven Mcdermott, IBM; Iqbal Saraf, IBM; Dr. Nicole Saulnier, IBM Research; Mr. Lukas Tierney, IBM; Dr. Alex Varghese, IBM Research
8:25 AM
(V) The Effect of Wafer Edge Cu Contamination on FinFET Devices
Dr. Yong Guo, Samsung Austin Semiconductor
8:50 AM
Semiconductor Failure Analysis in Automotive Industry at BMW: from X-ray Microscopy to ToF-SIMS Measurements on a STEM Lamella
Dr. Daniel Braun, BMW AG
9:15 AM
(V) Large-Scale CT Inspection of Feed-Through EMI Filters for Space Applications
Mr. John Bescup, Jet Propulsion Laboratory
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