AI Application for FA

Tuesday, November 1, 2022: 1:10 PM-4:10 PM
Ballroom A (Pasadena Convention Center)
* Image recognition for defect and end point detection
* Signal analysis for defect signature detection
* Data correlation and FA date bases
Dr. Sebastian Brand, Fraunhofer Institute for Microstructure of Materials and Systems and Dr. Daminda Dahanayaka, Globalfoundries
1:10 PM
Machine learning reinforced acoustic signal analysis for enhancing non-destructive defect localization and reliable identification
Dr. Sebastian Brand, Fraunhofer Institute for Microstructure of Materials and Systems; Mr. Michael Koegel, Fraunhofer Institute for Microstructure of Materials and Systems; Mr. Frank Altmann, Fraunhofer Institute for Microstructure of Materials and Systems; Dr. Christian Hollerith, Infineon Technologies AG; Mr. Pascal Gounet, STMicroelectronics
1:35 PM
INVITED TALK: Electronic component authenticity via electrical signal measurement and artificial intelligence with deep learning
Mr. Yung-Hsiao Chung, Global ETS; Mr. Feng Yu, Global ETS; Ms. Junjie Xiong, University of South Florida; Prof. Stephen Saddow, University of South Florida, Global ETS
2:00 PM
Automated Labeling Infrastructure for Failure Analysis
Dr. Natalia Mathá, Universität Klagenfurt; Dr. Konstantin Schekotihin, Universität Klagenfurt; Mr. Matthias Bergner, Fraunhofer Austria; Mrs. Doriana Cobârzan, Fraunhofer Austria; Dr. Marco Hudelist, Fraunhofer Austria
2:25 PM
A BERT-based Report Classification for Semiconductor Failure Analysis
Ms. Anna Safont-Andreu, Infineon Tech. Austria AG; Ms. Corinna Grabner, Infineon Tech. Austria AG, Universität Klagenfurt; Mr. Christian Burmer, Infineon Tech. AG; Dr. Konstantin Schekotihin, Universität Klagenfurt
2:50 PM
Refreshment Break
3:20 PM
Machine learning methods for FEOL/MEOL defects measurement through SRAM bitmap
Dr. Ningmu Nathan Zou, AMD; Mr. Seng Nguon (Raymond) Ting, AMD; Mr. Adam Rose, AMD
3:45 PM
1D-ResNet Framework for Ultrasound Signal Classification
Ms. Arya sukumaran Nair, PVA TePla Analytical Systems GmbH; Mr. Peter Hoffrogge, PVA TePla Analytical Systems GmbH; Dr. Peter Czurratis, PVA Tepla Analytical Systems GmbH; Mario Wolf, TU Freiberg; Dr. Elfgard Kuehnicke, TU Freiberg; Dr. Christian Hollerith, Infineon Technologies AG; Mr. Alexander Roch, Infineon Technologies AG; Mr. Alireza Haghighat, Infineon Technologies AG; Mr. Klaus Pressel, Infineon Technologies AG; Mr. Frank Zudock, Infineon Technologies AG
See more of: Technical Program
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