Microscopy and Material Analysis II

Thursday, November 3, 2022: 2:40 PM-3:05 PM

Ballroom B (Pasadena Convention Center)

* Electron Microscopy (SEM, EBSD, EDX, TEM, EELS)

* SIMS, XPS, ICPMS, RBS, Auger, etc...

* Mechanical testing and simulation

Dr. Wenbing Yun, PhD, Sigray, Inc. and Mr. Curtis Schreck, Analog Devices

2:40 PM

FIB-SIMS in FIB-SEMs: Practical Aspects for Physical Failure Analysis
Dr. Heiko Stegmann, Carl Zeiss Microscopy GmbH; Dr. Hubert Schulz, Carl Zeiss Microscopy GmbH; Dr. James Whitby, TOFWERK AG

See more of: Technical Program