Dr. Gary Clark

Electrical Failure Analyst
NXP Semiconductors
Product Diagnostic Center Austin
Austin, TX
USA 78735

Papers:

Multilayer pFIB Trenches for Multiple Tip EBAC/EBIRCH Analysis and Internal Node Transistor Characterization
On Demand Bit-Level SRAM Validation using CW 785nm Laser-Induced Fault Analysis (LIFA)
Cell-Aware test integration towards achieving 0 DPPB on automotive designs