Mr. Akihito Uchikado

Application engineer
Hamamatsu Photonics K.K.
System Division
Hamamatsu, Shizuoka
Japan 431-3196

Papers:

Die Level Fault Isolation - Application of NAND FLASH Failure Analysis using Visible ThermoDynamic ® Imaging
Die Level Fault Isolation - 3D VNAND Fault Isolation Method using Lock-In OBIRCH