Package Level Fault Isolation

Monday, November 17, 2025: 1:40 PM-2:40 PM
2 (Pasadena Convention Center)
Sylvia Lewis, Sigray Inc and Ms. Susan Li, Marvell
1:40 PM
Case Studies for Lock-in Thermography with Amplitude Modulated Radio Frequency Applied to Open Faults
Dr. Qingqing Wang, Thermo Fisher Scientific; Mr. Brian Lai, Thermo Fisher Scientific; Mr. Michael Morag, Thermo Fisher Scientific; Ms. Melissa Mullen, Thermo Fisher Scientific
2:00 PM
Correlative X-ray Nanotomography and FIB-SEM Microscopy for Hybrid Bond Failure Analysis
Dr. Allen Gu, Zeiss Microscopy; Carl Zeiss Microscopy
2:20 PM
EOTPR Fine pitch probing for die-to-die interconnect failure analysis
Ms. Bernice Zee, Advanced Micro Devices (AMD); Ms. Qiu Wen, Advanced Micro Devices (AMD)
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