Die Level Fault Isolation II

Thursday, November 20, 2025: 10:00 AM-11:00 AM
1 (Pasadena Convention Center)
10:00 AM
Detection Efficiency Improvements on Automated Soft Defect Localization Using Array-based Image Reconstruction
Mr. Benny Hsu, Advanced Micro Devices, Inc.; Mr. Arun Karunanithi, Advanced Micro Devices, Inc.; Mr. Kent Erington, Advanced Micro Devices, Inc.; Mr. Calder Wilson, Advanced Micro Devices, Inc.
10:20 AM
Electrical Failure Analysis of Speckled Shmoo and Shmoo Stripping failures
Ms. Amrutha Sampath, NXP Semiconductors; Mr. Kristofor Dickson, NXP Semiconductors; Mr. Dan Bodoh, NXP Semiconductors; Ms. Chik Hooi Liew, NXP Semiconductors
10:40 AM
Laser Probe Techniques with Adaptive FPGA Device
Mr. Zhi Hao Ko, AMD; Dr. Jobin Thomas Valliyakalayil, Liquid Instruments; Mr. Amitesh Kumar, Liquid Instruments
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