Sample Preparation and Device De-processing II

Thursday, November 20, 2025: 12:50 PM-1:30 PM

Ballroom B (Pasadena Convention Center)

Rosalinda Ring, NenoVision s. r. o. and Dr. Zachary Lingley, Infineon Technologies AG

12:50 PM

Uniform, Large-Area Delayering for Microelectronic Device Analysis: A Scalable Approach for Industrial Failure Analysis and Reverse Engineering
Dr. Pawel Nowakowski, E.A. Fischione Instruments, Inc.; Dr. Richard Wei-Chih Li, E.A. Fischione Instruments, Inc.; Ms. Mary Ray, E.A. Fischione Instruments, Inc.; Mr. Paul Fischione, E.A. Fischione Instruments, Inc.

1:10 PM

Novel Die Edge Delayering Methodology with Early Defined Lap Stop at Non-Low K Dielectric Layer and Gas Assisted PFIB Delayering
Mr. Benjamin Yuen Sum Lo, NXP Semiconductor; Mr. Andy Hsu, NXP Semiconductor; Mr. Tianyu Yang, NXP Semiconductor; Ms. Xinyu Tao, NXP Semiconductor; Mr. Rik Otte, NXP Semiconductor

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