AI Applications for Failure Analysis III

Tuesday, October 6, 2026: 3:20 PM-4:00 PM

Bridge Hall (Henry B. González Convention Center)

3:20 PM

From Access to Insight An AI-Based End-to-End Failure Analysis Pipeline Combining Laser Sample Prep, Correlative Navigation, and Automated Image Analytics
Mohammad Taghi Mohammadi Anaei, UConn; Adrian Phoulady, UConn; Matthew Maniscalco, UConn; Dr. Hongbin Choi, UConn; Parisa Mahyari, UConn; Dr. Nicholas May, Tescan; Dr. Sina Shahbazmohamadi, Tescan; Dr. Pouya Tavousi, Tescan

3:40 PM

Three-dimensional simulation of FIB-SEM image series from layout data for automatic FIB endpoint detection
Dr. Heiko Stegmann, Carl Zeiss Microscopy GmbH; Mr. Roland Salzer, Carl Zeiss Microscopy GmbH; Dr. Daniel Plencner, Carl Zeiss AG; Dr. Dmitrii Fedotov, Carl Zeiss AG; Dr. Eckhard Langer, Infineon Technologies Dresden GmbH & Co. KG

See more of: Technical Program